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Download e-book for iPad: Advances in Adhesives, Adhesion Science, and Testing by Dennis Damico (Editor)

By Dennis Damico (Editor)

ISBN-10: 0803134894

ISBN-13: 9780803134898

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Extra resources for Advances in Adhesives, Adhesion Science, and Testing

Example text

Because they were shipped in panel form, the composite adherends were bonded in 300 • 300 mm sheets. Each surface was abraded and then cleaned with acetone prior to bonding. 5 mm wire at the center and 20 mm from both ends of the composite panels. Initially, this wire was only placed at the ends of the panels, but this resulted in inconsistent bondlines due to deformation at the center of the composite panels. Once the bondline thickness was set, a thermocouple was added to the center of the specimen to monitor the bondline temperature profile.

Structural Steels Stress-strain curves for carbon and high-strength steels (250 to 485 MPa yield strength) and some quenched and tempered steels (690 MPa yield strength) exhibit a discontinuous yield plateau from which the upper and lower yield strengths can easily be determined, However, some quenched and tempered steels have stress-strain curves that exhibit a continuous transition from the elastic to the plastic region. 2 %. 2 % offset is reasonable for metals. Adhesives Unlike those of most structural steels, the stress-strain curves of 27 adhesives reported by Albrecht et al.

7--Three-dimensional digital contour plot of Specimen 2. SCOTT ET AL ON WOOD FAILURE 31 FIG. 8--Typical single-scan profile for Specimen 4 before and after fiattening. The gap in the data represents the hole visible on the cut surface (see Fig. 4). FIG. 9--An end-view representation of multiple laser-scan profiles across the surface of Specimen 4 corrected for warping of the adherend. Note: each division on the vertical scale is 500/am. 42o ,t;0o C u m u l a t i v e F r e q u e n c y (%) FIG. l O--Cumulative frequen O, distribution of wood failure for Specimen 4 denoting the bondline tolerance and the shallow woodfailure tolerance.

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Advances in Adhesives, Adhesion Science, and Testing by Dennis Damico (Editor)


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